LED display packaging technology comparison

July 13, 2024

When it comes to the realm of LED displays, the technology behind their encapsulation is pivotal. It's what shapes the visual appeal, longevity, and even the price tag. Each packaging technique has its own unique strengths, shining in areas like brightness, color richness, the breadth of viewable angles, how well it handles heat, and its overall dependability. Let's dive into the details and see how some of the most popular packaging technologies are making their mark in this industry.

SMD (Surface Mounted Device) surface mount device

Main products: Indoor Led Display, Outdoor Led Display

Characteristics: SMD technology using three-in-one or four-in-one package RGB (red, green and blue) chip, package body surface smooth, suitable for close viewing, can provide better visual effects and wide viewing angle.

Advantage: good color uniformity, wide viewing angle, suitable for indoor HD display and rental screen market.

Limitations: Relatively weak heat dissipation ability, not suitable for high brightness, large size outdoor applications.

GOB (Glue On Board) technology:

Main products: Micro GOB LED Display

Characteristics: Coating a layer of special gel on the surface of LED beads to enhance the waterproof and dustproof performance and prolong the service life.

Advantage: Improve the protection level of the display, especially suitable for outdoor environment, enhance the stability.

Limitations: May affect the heat dissipation performance, and to a certain extent increase the thickness of the display.

COB (Chip on Board) chip direct mounting:

Main products: Micro COB LED Display

Characteristics: COB technology directly pastes the LED chip on the PCB board and then encapsulates it, which reduces the bracket structure in traditional SMD and improves the integration and heat dissipation efficiency.

Advantage: Strong impact resistance, low maintenance cost, can effectively reduce moiré and enhance the display effect, especially suitable for stadiums, outdoor advertising and other scenes that require high stability.

Limitations: relatively high production cost and increased maintenance complexity.

GOB SMD

In this landscape, SMD (Surface-Mount Device) and COB (Chip on Board) packaging technologies stand out as the two primary approaches.

SMD technology is a cornerstone in the world of electronics manufacturing. It's known for its compact size, lightweight design, and impressive high-frequency performance. It's a favorite for automated production lines due to its ease of use and excellent thermal management. Plus, it's a breeze to repair and maintain. The SMD package comes in a variety of forms, like SOIC, QFN, BGA, LGA, and each one brings its own set of benefits and ideal applications to the table.

COB packaging technology is the chip directly welded to the PCB packaging technology. This technology is mainly used to solve the problem of LED heat dissipation, and to realize the close integration of the chip and the circuit board. Its features include compact package, good stability, good thermal conductivity and low manufacturing cost. However, COB packaging technology also has some drawbacks, such as maintenance difficulties, reliability dilemmas and high environmental requirements in the production process.

Overall, SMD and COB packaging technologies have their own characteristics, and their application and competition in the LED display industry reflect the diversity and complexity of the industry's technological development. As technology continues to advance and market demand changes, these packaging technologies will continue to evolve and improve to meet higher performance and cost-effectiveness requirements.

Author:

Mr. Alex

E-mail:

alexrgbdance@gmail.com

Phone/WhatsApp:

8613267107880